For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation.

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. To learn more about Ansys and Samsung Foundry, visit Samsung SAFE Forum 2023 on Jwhere Ansys CEO Ajei Gopal will deliver a keynote address. 'Our continuing partnership with Samsung keeps us at the forefront of silicon processing technology and helps our customers take full advantage of Samsung's 3D-IC technology.' 'Ansys' deep expertise in the areas of power management and system analysis have allowed us to engage with our customers at the chip, package, and system level,' said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys.

Ansys is a valuable partner that offers us proven simulation technology that our customers can use for thermal management and power analysis for better performance and higher reliability.' 'But it also raises a number of new challenges and multiphysics concerns that need to be carefully analyzed for system success. 'Samsung Foundry sees heterogeneous integration as a critical technology for the future of the semiconductor industry,' said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. RedHawk-SC verifies the electromigration (EM) reliability and voltage drop (IR drop) correctness of the entire power distribution network connecting the chiplets and interposer. Samsung also validated the predictive accuracy of RedHawk-SC Electrothermal with Ansys' Icepak solution for thermal analysis of electronic assemblies-including forced-air cooling and heat sinks. Samsung has collaborated with Ansys to certify RedHawk-SC Electrothermal for simulating temperature profiles with their packaging technology. A single die can draw well over 100W of power which must be routed through extremely fine microbump connections. The dense integration of multiple chips creates a major challenge in heat dissipation. Samsung offers a range of 2.5D packaging options ( I-Cube and H-Cube) as well as 3D vertical stacking with X-Cube technology. Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are made possible by 3D-IC technologies, which can also help companies achieve competitive differentiation in their markets.

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